The objective of NANOPACK is to establish a national facility for packaging of micro/nanoelectronic components and circuits in Greece, with a focus on heterogeneous integration. The Heterogeneous Integration Roadmap (HIR) jointly supported by IEEE and SEMI defines heterogeneous integration as the integration of individually manufactured components into higher-level components to enhance functionality and improve overall operational characteristics. Advanced packaging technologies such as flip-chip,bump, wafer-level package, 2.5D package (interposer), and 3D package have emerged in the way of heterogeneous integration technology implementation. To establish the capability for heterogeneous integration, multiple large equipment and precision fluid dispensing systems for bonding and quality testing tools like pull and shear tests are necessary. NANOPACK aims to address these needs for the Greek micro/nanoelectronics ecosystem and beyond.