The global chip shortage has exposed Europe’s vulnerability in microelectronics, threatening industries reliant on advanced semiconductors. Strengthening Europe’s technological resilience requires cutting-edge innovation and sustainable, scalable solutions to meet global demand. Addressing this challenge, the EU-funded APECS-PL project, part of the EU Chips Act, pioneers advanced packaging and heterogeneous integration for electronic components and systems. Coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD), it integrates novel testing, reliability methodologies and a system technology co-optimisation (STCO) framework. Positioned as a key player in Europe’s semiconductor ecosystem, APECS-PL supports a pan-European pilot line vision, enabling industry transfer and fostering eco-design aligned with the EU Green Deal. The project also emphasises skills development for future growth.